Zoals voor het COVID-tijdperk gebruikelijk was, organiseert HSB tijdens Offshore Energy-2022 in de RAI een workshop.
Indien u reeds een ticket hebt voor OEEC22, gelieve dan een email te sturen naar firstname.lastname@example.org zodat er geen overbodig ticket voor u wordt aangevraagd en dit beschikbaar blijft voor andere leden.
Michael Malik, Stema Systems: Silas 3D System
Silas 3D is a complete data acquisition, processing and interpretation system and is capable of mapping the Depth of Burial of objects such as power cables, pipelines, and other buried objects under the seafloor. Besides acoustically detecting UXO and existing pipes & cables during the engineering phase, it has the capacity to provide live cable tracking in the helmsman display, allowing real time visualization of the as-built cable position and DoB after trenching.
Roel Vanthillo, Marlinks: Continuous Depth of Burial Monitoring
Distributed Temperature Sensing (DTS) is a novel method to monitor burial depth (DoB) of offshore power cables. As opposed to snapshot cable tracker surveys, it has the benefit the DoB can be semi-continuously monitored. This reduces the risk of insufficiently protected cable by early detection and reduces the protection costs by only remediating the areas that really need protection.
Thomas Colonne, Van Oord: Implementing the vertical reference on the Saint-Brieuc Windfarm.
During pin pile installation far offshore, the surveyor faces a number of challenges to adjust each pin pile level: he is deprived of proper RTK and has to deal with strong currents. Some solutions found during the St-Brieuc project will be presented.
Daniel Cunny/Jack McCusker, SMD Artemis - Cable and Pipeline Tracking System
The globalisation of offshore wind is presenting new challenges for power cable detection and survey. SMD worked at a fundamental level to solve these issues with the Artemis system. Some key considerations for survey practitioners as users of this new system are presented. The speaker will depict the journey of development thus far to get this new technology to a point of market acceptance.